Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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this appears to be newly published research (3rd Aug. 2013) by Geoff & Co.

http://www.hindawi.com/journals/aoe/aip/930369/

PDF link at the top right of the page.

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