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Chip Scale Inventors' Biographies

SCHOTT technologist Jurgen Leib and ChipScale technologists Phil Marcoux and Wendell Sander are chiefly responsible for inventing the ChipScale IP. Together Jurgen, Phil and Wendell have over 80 years of experience researching, developing and commercializing innovative products and engineering solutions.




Jurgen Leib


Dr. Jürgen Leib is the inventor of the SCHOTT through-silicon via (TSV) interconnect technology. In 2001, he initiated the TSV activities at SCHOTT, targeting advanced wafer-level sensor packaging technologies for automotive, medical and MEMS. With a subsequent focus on image sensors, the technology was brought to production at SCHOTT Advanced Packaging Singapore in 2005, where he served as CTO. In 2006, Dr. Leib co-founded the MSG Lithoglas AG to act as consultant for Fraunhofer IZM on 3D-TSV developments. Dr. Leib is member of the Germany Physical Society (DGP) and IEEE CPMT.




Phil Marcoux

Phil Marcoux is the President and co-founder of ChipScale, Inc., and he formerly founded of AWI, Inc. in 1981 to work on early surface mount technology (SMT). Additionally, Phil has held various senior management positions, including Vice President of Technical Marketing and Sales at Tru-Si Technologies, Inc. and Vice President of Business Development for OSE Inc. He is a past Executive Director of MEPTEC, and a recipient of the IPC President’s Award. Phil holds a B.S.E.E. from University of Florida, and a M.S.E.E. degree from University of Santa Clara.




Wendell Sander

Wendell Sander is co-founder of ChipScale, Inc., but is more widely recognized as employee 16 at Apple Computer, where he developed Apple II peripherals and was design lead for the Apple III. In 1987 he helped create Mpulse Microwave, which generated many of the packaging concepts that would later be developed and extended by MicroSMT and subsequently ChipScale. Prior to Apple, Wendell spent 13 years at Fairchild Semiconductor. Wendell recently returned to Apple, where he works with his son on Hardware Engineering for the iPod family of products.
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