Rick Goerner

Specialties

Semiconductor and embedded software products, creating strategic relationships and integration of M&A activities

Semiconductors industry

October 2009 – Present (10 months)

Business development and financing support for small/mid size technology companies, including transition/interim CEO assignments

Semiconductors industry

February 2008 – October 2009 (1 year 9 months)

OTC.BB: PTSC) 2008-2009
Intellectual Property (IP) licensing; software and services for Healthcare, Public Safety and Justice; Hired, as Interim President/CEO, to outline, and execute, the transition of the company from revenue dependence on IP licensing to an operating entity. Appointed as full time President/CEO within nine months.
* Defined and implemented a business strategy to focus on data interoperability software for the healthcare, public safety and justice markets based on data sharing standards such as NIEM, GJXDM and HL7.
* Completed the acquisition, and integration, of three product entities- one full M&A transaction and the asset purchase of two product lines from Verras Medical and Kratos Defense and Security Solutions.
* Realigned sales, marketing and business development to support channel partnerships with large systems integrators and global strategic partner Hewlett-Packard.
* Initiated customer activities in Japan and SE Asia.
* Identified opportunities, and directed Patriot's minority investment strategy in three pre-revenue technology
companies and represented Patriot on each company's Board of Directors.
* Redefined, and enhanced, corporate IR and PR activities and initiated quarterly shareholder conference calls.
. * Recruited additional senior business/operational expertise to the Patriot Board of Directors.

Semiconductors industry

March 2006 – February 2008 (2 years)

President
* Directed business development activities to support several technology start-ups, including a full time Executive Chairman position at Qspeed Semiconductor, a Bay Area VC funded power IC company.
* Interim CEO position at Accelerated Performance Inc and HD Interconnect Technology Inc.
* Assisted GPS company (uNav Microelectronics) in fund raising and 802/11 WLAN company (Synad Technology) in developing sales organization and driving customer expansion activities in Asia.

Semiconductors industry

October 2005 – March 2006 (6 months)

* Integrated worldwide direct, and rep, sales, product marketing, marketing communications, customer service and support following acquisition by Oxford Semiconductor.
* Responsible for negotiating the sale of TransDimension's IP licensing business to ChipIdea Microelectronica

Semiconductors industry

February 2002 – October 2005 (3 years 9 months)

* Successful repositioning of company and managed growth of revenues from $2.5M to greater than $20M.
* Developed advanced product roadmap plans, including wireless USB strategy.
* Managed acquisition, and integration, of USB 2.0 product line IP from ARC International.
* Managed integration of software acquisition, SoftConnex, into full USB IC and software solution.
* Secured two rounds of financing totaling $18.5 million to support operations and IP acquisition.
* Expanded customer, and sales distribution, activities in Japan, SE Asia and Europe.
* Deloitte and Touche Orange County FAST 50 and U.S. FAST 500 Company in 2004

Semiconductors industry

1999 – 2002 (3 years)

Semiconductors industry

January 1996 – January 1999 (3 years 1 month)

* Directed product development, operations, marketing/sales and finance/administration of mixed signal
and digital/DSP product group for the mass storage (hard disk drive, optical and DVD drives) market.
* Led integration of Silicon Systems and Texas Instruments following the July 1996 acquisition.
* Responsible for full storage product group P&L activities.
* Directed revenue growth from $500 million to $1.1 billion during three years as President;
guiding $60+ million product and process R&D effort.

Semiconductors industry

January 1995 – January 1996 (1 year 1 month)

* Directed product development, operations (wafer fabrication and assembly/test), marketing/sales and P&L activities for TDK (Japan) Group Company. TDK acquired Silicon Systems in 1989. Product responsibilities included mass storage and telecommunications products.
* Directed day to day operations of No California wafer fabrication and Singapore assembly/test sites, maintained company relations and reporting to Japanese parent company.
* Participated in negotiating the sale of Silicon Systems to TI for $600 million.
* Member of Office of the President consisting of COO, CFO and TDK Japanese liaison.

Semiconductors industry

January 1992 – January 1995 (3 years 1 month)

Semiconductors industry

January 1986 – January 1992 (6 years 1 month)

Semiconductors industry

January 1982 – January 1986 (4 years 1 month)

Semiconductors industry

January 1976 – January 1982 (6 years 1 month)

Semiconductors industry

January 1973 – January 1976 (3 years 1 month)

Semiconductors industry

January 1970 – January 1972 (2 years 1 month)

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