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QUALCOMM Licenses USB On-The-Go Technology from TransDimension for 3G Chipsets
11/13/2002 - QUALCOMM, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and TransDimension, a privately held company that develops and markets connectivity solutions based on Universal Serial Bus (USB) and BluetoothTM technologies, announced the licensing by QUALCOMM of TransDimension's USB On-The-Go (OTG) technology.
USB is a serial interface that allows communication between hosts such as PCs and peripherals. As more portable devices adopt the USB interface, direct connectivity - without a PC as an intermediary - has become a necessity. The OTG Supplement to the USB 2.0 Specification defines several enhancements that address the growing need for mobile connectivity, including a USB peripheral with host capability to communicate with other selected USB peripherals, a mobile-form-factor USB connector, and low-power capabilities to preserve battery life. Wireless handsets using QUALCOMM chipsets that incorporate the OTG technology will enable access to a multitude of existing USB devices - including accessories such as printers, digital cameras, keyboards, audio players and CD-ROMs.
"QUALCOMM is committed to providing our customers with the most cost-effective and highly integrated 3G wireless solutions in the industry," said Don Schrock, president of QUALCOMM CDMA Technologies. "Partnering with TransDimension and integrating its complete OTG solution into QUALCOMM products will enable a new generation of connectivity between leading-edge third-generation (3G) wireless terminals and numerous USB devices."
"We are proud QUALCOMM has chosen our technology to bring innovative new connectivity features like OTG to their next-generation chipsets," said Rick Goerner, CEO of TransDimension. "We were able to offer the industry's most complete OTG solution, consisting of our USB OTG Controller IP Core, USBLink OTG software and class drivers, and we are pleased that QUALCOMM is making it part of their overall connectivity solution."
Headquartered in Irvine, Calif., TransDimension is a privately held company founded in 1997 to develop and market embedded and mobile connectivity solutions based on intelligent USB and BluetoothTM technologies. TransDimension's product lines include integrated circuits, optimized Intellectual Property (IP) cores, software stacks and development tools that enable direct wired and wireless interconnectivity and I/O for a wide range of embedded applications and mobile devices that until now have required an indirect means, such as a PC host, of exchanging data. SoftConnex, an independent subsidiary of TransDimension, delivers a complete software solution for the USB embedded market. Their flagship product, USBLink Host, provides the broadest platform support and the largest library of class drivers available for the embedded market.
QUALCOMM Incorporated is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. Bluetooth and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc., U.S.A.
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QUALCOMM Licenses USB On-The-Go Technology from TransDimension for 3G Chipsets
11/13/2002 - QUALCOMM, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and TransDimension, a privately held company that develops and markets connectivity solutions based on Universal Serial Bus (USB) and BluetoothTM technologies, announced the licensing by QUALCOMM of TransDimension's USB On-The-Go (OTG) technology.
USB is a serial interface that allows communication between hosts such as PCs and peripherals. As more portable devices adopt the USB interface, direct connectivity - without a PC as an intermediary - has become a necessity. The OTG Supplement to the USB 2.0 Specification defines several enhancements that address the growing need for mobile connectivity, including a USB peripheral with host capability to communicate with other selected USB peripherals, a mobile-form-factor USB connector, and low-power capabilities to preserve battery life. Wireless handsets using QUALCOMM chipsets that incorporate the OTG technology will enable access to a multitude of existing USB devices - including accessories such as printers, digital cameras, keyboards, audio players and CD-ROMs.
"QUALCOMM is committed to providing our customers with the most cost-effective and highly integrated 3G wireless solutions in the industry," said Don Schrock, president of QUALCOMM CDMA Technologies. "Partnering with TransDimension and integrating its complete OTG solution into QUALCOMM products will enable a new generation of connectivity between leading-edge third-generation (3G) wireless terminals and numerous USB devices."
"We are proud QUALCOMM has chosen our technology to bring innovative new connectivity features like OTG to their next-generation chipsets," said Rick Goerner, CEO of TransDimension. "We were able to offer the industry's most complete OTG solution, consisting of our USB OTG Controller IP Core, USBLink OTG software and class drivers, and we are pleased that QUALCOMM is making it part of their overall connectivity solution."
Headquartered in Irvine, Calif., TransDimension is a privately held company founded in 1997 to develop and market embedded and mobile connectivity solutions based on intelligent USB and BluetoothTM technologies. TransDimension's product lines include integrated circuits, optimized Intellectual Property (IP) cores, software stacks and development tools that enable direct wired and wireless interconnectivity and I/O for a wide range of embedded applications and mobile devices that until now have required an indirect means, such as a PC host, of exchanging data. SoftConnex, an independent subsidiary of TransDimension, delivers a complete software solution for the USB embedded market. Their flagship product, USBLink Host, provides the broadest platform support and the largest library of class drivers available for the embedded market.
QUALCOMM Incorporated is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. Bluetooth and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc., U.S.A.
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Field programmable gate array blog
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- Boards, Busses
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EDA News
- » Kronos Selects GreenPeak Low Power Mesh Technology for Wireless Terminal
- » VLSI-TSA Features Papers on High-k Metal Gates, finFET, Flash, CMOS
- » Freescale to Host Technology Forum Americas 2008
- » NEC Samples LTPS TFT 2.7-inch LCD Module with 413 Pixels per Inch
- » microchipDIRECT Offers Integration Associates EZLink Development Kit
- » Micron, Nanya Form DRAM Joint Venture - MeiYa Technology Corporation
- » Embedded Masterclass Draws Developers with Linux Workshops
- » Lattice Semiconductor, Aldec Team on OEM FPGA Mixed Language Simulator
- » Northwest Logic Debuts PCI Express 2.0 Solution for Xilinx Virtex-5FXT
- » Cornet Unveils VME PowerPC Conduction Cooled Single Board Computer
- » TapRoot, Freescale Team to Integrate Windows Mobile with 3G Chipset
- » NI Introduces PXI-8104, PXI-8183 Low-Cost PXI Embedded Controllers
- » AMCC Unveils Arches Reference Design Kit for PowerPC 460GT Processor
- » IAR Systems Announces Embedded Workbench for AVR XMEGA
- » Enea Acquires IP Devel
- » SMIC, ASTRI Team on Dual Mode UWB MAC ASIC
- » Aeroflex, Innowireless Accelerate Development of 3GPP LTE Mobile Devices
- » Ramtron Creates First FM6124 F-RAM Based Event Data Recorder
- » Evatronix Launches SDIO-HOST Controller IP Core
- » Renesas, IMEC to Research 45nm Reconfigurable RF Transceiver
- » Lattice Semiconductor, Synplicity Expand OEM Agreement
- » Actel Licenses Sarnoff TakeCharge Electrostatic Discharge Solution
- » Sundance Announces SMT8121 Communications Development Platform
- » Silicon Image Debuts 12MP Camera Processor IP Core for Mobile Devices
- » Opal-RT Improves TestDrive OP6000 Engine ECU Testing Platform
- » Opal-RT Unveils RT-LAB Orchestra Real-Time Framework for Co-Simulation
- » Freescale Debuts ColdFire MCF5227x LCD Processor with Touch Controller
- » Freescale Launches mobileGT MPC5123 Dual-Core Processor
- » Freescale Bundles CodeWarrior into Tools Suites
- » Quatech Rolls Out Airborne Embedded 802.11 Radio for M2M Market
- » TI Introduces Z-Accel CC2480 ZigBee Wireless Network Processor
- » Zensys Selects Kilopass XPM Embedded Memory for Remote Home Control
- » American Portwell Joins Small Form Factor Special Interest Group
- » GrammaTech Receives DARPA Contract for Static Analysis Technology
- » Telelogic to Showcase UML Modeling Tools at Embedded Masterclass
- » Legend Silicon Rolls Out LGS-8G52 DTV Demodulator Chip for China
- » Innovation First, Charmed Labs Team on Qwerk VEX Microcontroller
- » IBM Chip Alliance Makes Breakthrough with High-K Metal Gate Gate Material
- » Si2 Introduces Common Power Format Relational Analyzer Tool
- » TSMC PDK Features Cadence QRC Extraction, Virtuoso Passive Component Designer
- » Netrino Announces Embedded Software Boot Camp
- » GNAT Pro High-Integrity Edition for DO-178B Supports VxWorks 653 2.2
- » AdaCore Rolls Out GNATbench 2.1.0 Eclipse-based Ada IDE
- » MIPS Creates First Hot Spot Analyzer for Fast Linux Kernel Profiling
- » Omnitrol, TI Team on Real-Time RFID Traceability for PCB Manufacturing
- » Hitec to Showcase Electronic Systems Enclosures at Embedded Masterclass
- » Jennic Announces JN5139-EK020 IEEE802.15.4 JenNet Starter Kit
Embedded Star and Embedded Blog are trademarks of Online Desti
QUALCOMM Licenses USB On-The-Go Technology from TransDimension for 3G Chipsets
11/13/2002 - QUALCOMM, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and TransDimension, a privately held company that develops and markets connectivity solutions based on Universal Serial Bus (USB) and BluetoothTM technologies, announced the licensing by QUALCOMM of TransDimension's USB On-The-Go (OTG) technology.
USB is a serial interface that allows communication between hosts such as PCs and peripherals. As more portable devices adopt the USB interface, direct connectivity - without a PC as an intermediary - has become a necessity. The OTG Supplement to the USB 2.0 Specification defines several enhancements that address the growing need for mobile connectivity, including a USB peripheral with host capability to communicate with other selected USB peripherals, a mobile-form-factor USB connector, and low-power capabilities to preserve battery life. Wireless handsets using QUALCOMM chipsets that incorporate the OTG technology will enable access to a multitude of existing USB devices - including accessories such as printers, digital cameras, keyboards, audio players and CD-ROMs.
"QUALCOMM is committed to providing our customers with the most cost-effective and highly integrated 3G wireless solutions in the industry," said Don Schrock, president of QUALCOMM CDMA Technologies. "Partnering with TransDimension and integrating its complete OTG solution into QUALCOMM products will enable a new generation of connectivity between leading-edge third-generation (3G) wireless terminals and numerous USB devices."
"We are proud QUALCOMM has chosen our technology to bring innovative new connectivity features like OTG to their next-generation chipsets," said Rick Goerner, CEO of TransDimension. "We were able to offer the industry's most complete OTG solution, consisting of our USB OTG Controller IP Core, USBLink OTG software and class drivers, and we are pleased that QUALCOMM is making it part of their overall connectivity solution."
Headquartered in Irvine, Calif., TransDimension is a privately held company founded in 1997 to develop and market embedded and mobile connectivity solutions based on intelligent USB and BluetoothTM technologies. TransDimension's product lines include integrated circuits, optimized Intellectual Property (IP) cores, software stacks and development tools that enable direct wired and wireless interconnectivity and I/O for a wide range of embedded applications and mobile devices that until now have required an indirect means, such as a PC host, of exchanging data. SoftConnex, an independent subsidiary of TransDimension, delivers a complete software solution for the USB embedded market. Their flagship product, USBLink Host, provides the broadest platform support and the largest library of class drivers available for the embedded market.
QUALCOMM Incorporated is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
QUALCOMM is a registered trademark of QUALCOMM Incorporated. Bluetooth and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc., U.S.A.
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<a href="http://embeddedstar.trade... target="_parent"><img src="/images/imaging300.gif" width="300" height="250" alt="free advanced imaging publication" border="0" /></a>
| Enter your search terms Submit search form | |||||
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Embedded Star Newsletter
Don't have time to visit Embedded Star everyday? Then sign up for our free newsletter. We'll send you an email when we have something to share with you. Your email address will be kept confidential and we will not share, sell, or rent it to anyone. You can unsubscribe at any time by clicking a link in the email.
Enter your email address to sign up for our free newsletter:
If you are familiar with RSS feeds, you can also sign up for our free blog feed. Our RSS feed is updated in real-time while our newsletter is updated daily.
EDA Geek
Electronic design automation news and events
EDA Blog
Blog about the electronic design automation industry
FPGA Blog
Field programmable gate array blog
Blog Archives
- Articles
- Boards, Busses
- BSP
- Components
- DSP
- EDA Tools
- Embedded Systems
- Equipment
- FPGA
- IDE
- Industrial
- IP Core
- Microcontrollers
- Models, Simulations
- Networking
- News
- Other
- Reference Design
- Research
- Robotics
- RTOS
- Test Solution
- UML
- Wireless
- Other
Embedded Directory
Subscribe to Embedded Star
EDA News
- » Kronos Selects GreenPeak Low Power Mesh Technology for Wireless Terminal
- » VLSI-TSA Features Papers on High-k Metal Gates, finFET, Flash, CMOS
- » Freescale to Host Technology Forum Americas 2008
- » NEC Samples LTPS TFT 2.7-inch LCD Module with 413 Pixels per Inch
- » microchipDIRECT Offers Integration Associates EZLink Development Kit
- » Micron, Nanya Form DRAM Joint Venture - MeiYa Technology Corporation
- » Embedded Masterclass Draws Developers with Linux Workshops
- » Lattice Semiconductor, Aldec Team on OEM FPGA Mixed Language Simulator
- » Northwest Logic Debuts PCI Express 2.0 Solution for Xilinx Virtex-5FXT
- » Cornet Unveils VME PowerPC Conduction Cooled Single Board Computer
- » TapRoot, Freescale Team to Integrate Windows Mobile with 3G Chipset
- » NI Introduces PXI-8104, PXI-8183 Low-Cost PXI Embedded Controllers
- » AMCC Unveils Arches Reference Design Kit for PowerPC 460GT Processor
- » IAR Systems Announces Embedded Workbench for AVR XMEGA
- » Enea Acquires IP Devel
- » SMIC, ASTRI Team on Dual Mode UWB MAC ASIC
- » Aeroflex, Innowireless Accelerate Development of 3GPP LTE Mobile Devices
- » Ramtron Creates First FM6124 F-RAM Based Event Data Recorder
- » Evatronix Launches SDIO-HOST Controller IP Core
- » Renesas, IMEC to Research 45nm Reconfigurable RF Transceiver
- » Lattice Semiconductor, Synplicity Expand OEM Agreement
- » Actel Licenses Sarnoff TakeCharge Electrostatic Discharge Solution
- » Sundance Announces SMT8121 Communications Development Platform
- » Silicon Image Debuts 12MP Camera Processor IP Core for Mobile Devices
- » Opal-RT Improves TestDrive OP6000 Engine ECU Testing Platform
- » Opal-RT Unveils RT-LAB Orchestra Real-Time Framework for Co-Simulation
- » Freescale Debuts ColdFire MCF5227x LCD Processor with Touch Controller
- » Freescale Launches mobileGT MPC5123 Dual-Core Processor
- » Freescale Bundles CodeWarrior into Tools Suites
- » Quatech Rolls Out Airborne Embedded 802.11 Radio for M2M Market
- » TI Introduces Z-Accel CC2480 ZigBee Wireless Network Processor
- » Zensys Selects Kilopass XPM Embedded Memory for Remote Home Control
- » American Portwell Joins Small Form Factor Special Interest Group
- » GrammaTech Receives DARPA Contract for Static Analysis Technology
- » Telelogic to Showcase UML Modeling Tools at Embedded Masterclass
- » Legend Silicon Rolls Out LGS-8G52 DTV Demodulator Chip for China
- » Innovation First, Charmed Labs Team on Qwerk VEX Microcontroller
- » IBM Chip Alliance Makes Breakthrough with High-K Metal Gate Gate Material
- » Si2 Introduces Common Power Format Relational Analyzer Tool
- » TSMC PDK Features Cadence QRC Extraction, Virtuoso Passive Component Designer
- » Netrino Announces Embedded Software Boot Camp
- » GNAT Pro High-Integrity Edition for DO-178B Supports VxWorks 653 2.2
- » AdaCore Rolls Out GNATbench 2.1.0 Eclipse-based Ada IDE
- » MIPS Creates First Hot Spot Analyzer for Fast Linux Kernel Profiling
- » Omnitrol, TI Team on Real-Time RFID Traceability for PCB Manufacturing
- » Hitec to Showcase Electronic Systems Enclosures at Embedded Masterclass
- » Jennic Announces JN5139-EK020 IEEE802.15.4 JenNet Starter Kit
Embedded Star and Embedded Blog are trademarks of Online Desti
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